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New bond issue: Amkor Technology issued international bonds (USU03169AM81) with a 6.625% coupon for USD 525.0m maturing in 2027

March 14, 2019 | Cbonds

March 13, 2019 Amkor Technology issued international bonds (USU03169AM81) with a 6.625% for USD 525.0m maturing in 2027. Bonds were sold at a price of 99.5%. Bookrunner: Bank of America Merrill Lynch, Morgan Stanley. Depository: Clearstream Banking S.A., Euroclear Bank.

发行 Amkor Technology, 6.625% 15sep2027, USD

状态风险国家赎回(报价)容量排放评级(M / S& P / F)
outstandingUSA15.09.2027525.000.000 USD-/BB/-

公司: Amkor Technology

完整的公司名称Amkor Technology, Inc.
风险国家USA
注册国家USA
行业Information and High Technologies

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