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New bond issue: Summit Materials issued international bonds (USU8603VAJ18) with a 5.25% coupon for USD 700.0m maturing in 2029

July 31, 2020 | Cbonds

July 27, 2020 Summit Materials issued international bonds (USU8603VAJ18) with a 5.25% for USD 700.0m maturing in 2029. Bonds were sold at a price of 100%. Bookrunner: Barclays, Bank of America Merrill Lynch, Capital One Financial Corporation, Citigroup, Deutsche Bank, Goldman Sachs, RBC Capital Markets, Jefferies. Depository: Clearstream Banking S.A., Euroclear Bank.

发行 Summit Materials, 5.25% 15jan2029, USD

状态风险国家赎回(报价)容量排放评级(M / S& P / F)
outstandingUSA15.01.2029700.000.000 USDB2/BB/-

公司: Summit Materials

完整的公司名称Summit Materials, LLC
风险国家USA
注册国家USA
行业Construction and development

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